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EPHRAIM SUHIR

EPHRAIM SUHIR

Bell Laboratories, Physical Sciences and Engineering Research Division, Murray Hill, NJ, USA
Portland State University
Portland, OR, USA

Biography

Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, Technical University, Vienna, Austria and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 450+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”). Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. His most recent awards are 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems and 2019 Int. Microelectronic Packaging Society’s (IMAPS) Lifetime Achievement award for making exceptional, visible, and sustained impact on the microelectronics packaging industry and technology.

Research Interest

Applied Mathematics and Mechanics, Applied and Mathematical Physics, Analytical (Mathematical) Modeling in Applied Science and Engineering,Materials Science and Engineering, Aerospace and Automotive Electronics and Photonics Design for Reliability (DfR) of Electronic, Opto-Electronic and Photonic Assemblies, Packages and Systems, Applied Probability and Probabilistic DfR (PDfR) of Electronic and Photonic Materials, Devices and Systems Photonics, Fiber Optics, Mechanics of Optical Fibers, Thin Film Mechanics and Physics Shock and Vibration Analyses and Testing, Dynamic Response of Materials and Structures to Shocks and Vibrations, Thermal Stress Analysis, Prediction and Prevention of Thermal Stress Failures in Electronics and Photonics Solder Materials and Solder Joint Interconnections in Electronic and Photonic Engineering, Polymeric Materials in Electronics and Photonics.